M-PLEX Bond Repairing Conditioner 300ml

Apply to wet hair, massage gently and rinse. Use with M-Plex Bond Repairing Shampoo for best results.

Naturally Derived Ingredients: M-Plex Bond Technology, our new and innovative bond-building technology, helps protect, strengthen and repair damaged hair from harmful effects. Its innovative composition leads to enhanced performance for outstanding softening and shine. Hydropower Bond Technology, with Coconut Water and Abyssinian Oil, nourishes and seals the cuticle for smoother, healthier-looking hair. Aqua (Water/Eau), Cetearyl Alcohol, Caprylic/Capric Triglyceride, Glycerin, Behentrimonium Chloride, Quaternium-91, Fragrance/Parfum, PPG-3 Benzyl Ether Myristate, Bis-PCA Dimethicone, Disodium PEG-12 Dimethicone Sulfosuccinate, Divinyldimethicone/Dimethicone Copolymer, Hydrolyzed Adansonia Digitata (Baobab) Extract, Hydrolyzed Linseed Seed, Aloe Barbadensis Leaf Juice, Camellia Sinensis (Green Tea) Leaf Extract, Aspalathus Linearis (Rooibos) Leaf Extract, Cocos Nucifera (Coconut) Liquid Endosperm, Lycium Barbarum (Goji) Fruit Extract, Olea Europaea (Olive) Fruit Oil, Crambe Abyssinica (Abyssinian) Seed Oil, C12-13 Pareth-23, C12-13 Pareth-3, Amodimethicone, C11-15 Pareth-7, Laureth-9, Cetrimonium Chloride, Trideceth-12, Vitis Vinifera (Grape) Seed Oil, Helianthus Annuus (Sunflower) Seed Oil, Glycine Soja (Soybean) Oil, Cetyl Esters, Panthenol, PEG 45M, Isododecane, Phenoxyethanol, Isopropyl Alcohol, Glycerin, Olea Europaea (Olive) Fruit Extract, Malpighia Glabra (Acerola) Fruit Extract, Persea Gratissima (Avocado) Oil, Polysilicone-15, Butylene Glycol, Helianthus Annuus (Sunflower) Seed Extract, Salvia Hispanica (Chia) Seed Extract, Saccharomyces Cerevisiae (Brewer's Yeast) Extract, Leuconostoc/Radish Root Ferment Filtrate, Maltodextrin, Guar Hydroxypropyltrimonium Chloride, Sodium Chloride, Aminomethyl Propanol, Benzoic Acid, Disodium EDTA, Benzyl Alcohol, Sodium Benzoate, Potassium Sorbate, Citric Acid, Ethylhexylglycerin, Linalool, Benzyl Benzoate, Limonene.

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